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2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling

2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling

  • 2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling
  • 2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling
  • 2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling
2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TIC800Y
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm
Delivery Time: 3-6 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Keyword: RoHS Compliant Yellow Thermal Phase Change Applicatoin: Power Semiconductors
Density: 2.2g/cc Thermal Conductivity: 0.95 W/mK
Phase Transition Temp: 50℃~60℃ Material: Phase Change Pad
High Light:

thermal phase change material

,

phase change thermal pad

Power semiconductors applied RoHS Compliant yellow thermal phase change pad pcm TIC 800Y

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

The TIC™800Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™800Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


Features


> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required


Applications


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

 

 

                                Typical Properties of TIC™800Y Series

 

Product Name
TICTM803Y
TICTM805Y
TICTM808Y
TICTM810Y
Testing standards
Color
Yellow
Yellow
Yellow
Yellow
Visual
Composite Thickness
0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.2g/cc
Helium Pycnometer
Work temperature
-25℃~125℃
 
phase transition temperature
50℃~60℃
 
Setting temperature
70℃ for 5 minutes
 
Thermal conductivity
0.95 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)
0.021℃-in²/W
0.024℃-in²/W
0.053℃-in²/W
0.080℃-in²/W
ASTM D5470 (modified)
0.14℃-cm²/W
0.15℃-cm²/W
0.34℃-cm²/W
0.52℃-cm²/W
 

Standard Thicknesses:
0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.


Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.


Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.


Reinforcement:
No reinforcement is necessary.

 
2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling 0
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Sales Manager

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)

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