|
|
High-performance thermal conductive silicone sheet TIF300: Stable heat conduction, reliable protection TIF300 thermal conductive silicone sheet is a thermal interface material specially developed by ZIITEK for high-power electronic components. It features excellent thermal conductivity, electrical ... Read More
|
|
|
TIF two-component thermal conductive gel: The essence of upgrading the heat dissipation of charging piles lies in the collaborative iteration of materials and technology As a paste-like flexible thermal conductive medium, thermal conductive gel does not require curing and has excellent fluidity. It ... Read More
|
|
|
The core features of TIF700RES and their alignment with server requirements The power consumption of modern server CPUs/GPUs is extremely high, and the heat is concentrated instantly. High thermal conductivity materials are needed to quickly transfer the heat to the heat dissipation module (such as ... Read More
|
|
|
The TIF800SE 15W high-performance thermal conductive material makes a stunning debut, empowering advanced cooling solutions in various fields Recently, our company has officially launched the newly developed TIF800SE 15W high-performance thermal conductive silicone sheet. This product, with its ... Read More
|
|
|
The heat dissipation of new energy vehicle charging piles has been upgraded, and TIF's two-component thermal conductive gel has become the key choice. High temperatures are the "invisible killer" for the operation of charging piles. Equipment failures caused by poor heat dissipation account for over ... Read More
|
|
|
The heat dissipation problem of high-power OBC chargers can be easily solved by TIS thermal insulation sheets. In the trend of new energy vehicles moving towards high-power fast charging, the on-board charger (OBC), as the core hub for energy conversion, is bearing increasingly high performance ... Read More
|
|
|
Record of Communication Activities of among ZIITEK companies in different area The core of TIM and Team is the conductivity The core of thermal conductive materials lies in efficiently transferring energy, eliminating barriers, and achieving synchronous resonance between systems. And an excellent ... Read More
|
|
|
Ziitek starts a new journey with running and condenses the future with strength! Time flies and the struggle never stops. In 2025, Ziitek team kept walking, and deeply cultivated the field of heat conducting materials with concentration and enthusiasm; In 2026, we are ready to start and meet new ... Read More
|
|
|
Why can the flexible filling of the two-component thermal conductive gel achieve seamless heat dissipation? In the field of electronic device heat dissipation, "interface adhesion" is a key issue determining the efficiency of heat dissipation. The surfaces of core components such as high-power chips ... Read More
|
|
|
Ziitek Technology Ltd, wishes you a happy 2026!! https://youtube.com/shorts/X7wNRef7oVI?feature=share Read More
|