Application and challenges of thermal conductive gel in heat dissipation of electronic devices

Thermally conductive gel has been widely used in the field of heat dissipation of electronic devices as an efficient thermal conductive material. Its unique gel texture and excellent thermal conductivity make it able to effectively export the heat inside the electronic equipment to ensure the stable operation of the equipment. However, in practice, thermally conductive gels also face some challenges.

First of all, the application scenarios of thermal conductivity gel are diverse, and it needs to be customized according to different equipment structures and heat dissipation requirements. This requires that the thermal conductivity gel has high plasticity and adaptability, and can achieve uniform and effective heat conduction on heat dissipation surfaces of different shapes and sizes. However, this also brings the difficulty of manufacturing and processing, which requires the investment of significant R&D and production resources.

Secondly, the thermal conductivity of thermal conductivity gel is its most core advantage, but how to further improve its thermal conductivity efficiency is still one of the current challenges. With the continuous improvement of the performance of electronic equipment, the demand for heat dissipation is also increasing day by day. Thermal conductivity gel needs to continuously improve its thermal conductivity and heat dissipation efficiency to meet higher heat dissipation requirements.

In addition, the thermal conductive gel may be affected by environmental factors such as temperature and humidity during long-term use, resulting in changes in its performance. Therefore, how to ensure the stability and reliability of thermal conductive gel in complex environment is also one of the important challenges it faces.

In view of these challenges, researchers are constantly exploring new material formulations and preparation processes to improve the performance and stability of thermal conductive gels. At the same time, with the continuous development of science and technology, new heat dissipation technologies and materials are also emerging, providing a broader space and possibility for the application of thermal conductive gel.