From CPU to IGBT: Thermal Conductive Paste Selection and Thermal Management Optimization Guide

With the continuous increase in the power density of electronic devices, effective thermal management has become a key factor in ensuring the reliability and performance of the system. From the central processing unit (CPU) of personal computers to IGBTs in the power electronics field, if the heat generated by electronic components during operation cannot be promptly dissipated, the temperature will rise sharply, which will affect the performance of the equipment, shorten its service life, and even cause malfunctions.

Thermal conductive silicone is a common type of thermal interface material, which is widely used in the cooling systems of various electronic devices due to its excellent thermal conductivity, convenient application, and cost advantages. However, in response to the diverse requirements of different application scenarios, how to scientifically select and use thermal conductive silicone to achieve good thermal management results remains a practical challenge for engineers.
Thermal conductive silicone is a paste-like composite material composed of an organic silicon matrix and a conductive filler. Its working principle is to fill the microscopic gaps between the heat sink and the heating element, remove the air between the interfaces, and establish an effective heat conduction channel. The key performance indicators of thermal conductive silicone include thermal conductivity (typically ranging from 1.2 to 25 W/m·K), thermal resistance (significantly affected by thickness and contact area), operating temperature range (-40°C to 200°C), dielectric strength (important for insulation applications), and rheological properties such as viscosity and thixotropy. Additionally, the stability of performance over long-term use, including resistance to aging, drying, and pump-out ability, is also a factor to consider in practical applications.

Thermal conductive silicone is a key material for thermal management in electronic devices. The correct selection and application of this material have a significant impact on the performance and reliability of the devices. In the future, as the power density of electronic devices continues to increase and the application scenarios become more diverse, the technology of thermal conductive silicone will develop towards higher thermal conductivity, better stability, and greater intelligence.