New standard for AI chip cooling: An effective thermal management solution using thermal conductive silicone grease

Today, with the rapid development of artificial intelligence (AI) technology, AI chips, as the core hardware, have seen continuous improvements in performance and increasingly faster computing speeds. However, at the same time, the heat generated by the chips during operation is also increasing day by day. Excessive temperature not only affects the performance of the chips but may also shorten their lifespan or even cause damage. Therefore, effective cooling technology is crucial for the stable operation of AI chips. Among various cooling materials and solutions, conductive silicone grease is gradually becoming the new standard for cooling AI chips, providing an effective solution to the thermal management problem of AI chips.

Thermal conductive silicone grease is a thermally conductive organic silicone paste-like compound made from organic silicone rubber as the main raw material, with materials that have excellent heat resistance and thermal conductivity added. Its main function is to fill the tiny gaps between the chip and the heat sink. From a microscopic perspective, the contact surface between the chip and the heat sink has a large number of tiny depressions and gaps, and the air remaining in these gaps has a very low thermal conductivity of approximately 0.024 W/mk, seriously hindering the heat transfer. However, the thermal conductivity of thermal conductive silicone grease is usually in the range of 1.0 - 5.2 W/mk. It can fill these gaps and form a continuous heat conduction path, increasing the contact area to over 95%, effectively replacing air as a heat conduction medium, significantly reducing the interface thermal resistance, and thus quickly transferring the heat generated by the chip to the heat sink, achieving effective heat dissipation.

The characteristics of TIG thermal conductive silicone grease:
Thermal conductivity: 1.0 W - 5.2 W/mk
Excellent low thermal resistance
Non-toxic, environmentally friendly and safe, meeting RoHS standards
Excellent long-term stability
High thixotropy, facilitating operation
Fully fills the microscopic contact surfaces, creating low thermal resistance

With the continuous development of AI technology, the performance of AI chips will continue to improve, and the demand for heat dissipation will also increase. Thermal conductive silicone grease, due to its unique heat dissipation advantages, cost-effectiveness and good applicability, has become an important choice for heat dissipation of AI chips. In the future, with the continuous progress of materials science, the performance of thermal conductive silicone grease is also expected to further improve, providing more powerful thermal management support for the stable operation of AI chips and the development of AI technology.