TIC800G-ST, as a rising star in the field of heat conduction, was officially launched in April

Today, with the rapid development of technology, high-performance devices have increasingly strict requirements for heat dissipation technology. To meet this demand, we are proud to present TIC800G-ST - a new heat conduction star tailor-made for high-performance equipment.

The TICTM800G-ST series phase change thermal conductive patch is a type of thermal conductive phase change composite material, specifically designed for application scenarios that require repeated assembly, such as filling the gap between removable optical modules and heat sinks. It features excellent thermal conductivity and outstanding adhesion, making it easy to adhere to heat sinks. Meanwhile, the special thermal conductive film composite material can withstand multiple plugging and unplugging of the optical module without breaking, protecting the surface of the heat sink and the optical module while reducing thermal resistance, providing an excellent thermal management solution for high-power optical modules. The standard size provided by the TICTM800G-ST series can meet the heat dissipation design requirements of most optical modules.