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TIS thermal conductive potting adhesive: provides a solid backing for heat dissipation and protection of power supply

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TIS thermal conductive potting adhesive: provides a solid backing for heat dissipation and protection of power supply
Latest company news about TIS thermal conductive potting adhesive: provides a solid backing for heat dissipation and protection of power supply

TIS thermal conductive potting adhesive: provides a solid backing for heat dissipation and protection of power supply

 

In today's increasingly vigorous development of electronic equipment, power supply is the heart of equipment, its stability and reliability are very important. However, with the improvement of power density and the complexity of working environment, the problem of heat dissipation and protection of power supply has become increasingly prominent. To meet this challenge, we have introduced TIS thermal potting adhesive, which provides a solid backing for power supply with good thermal conductivity and protection.

 

TIS thermal potting adhesive adopts excellent thermal conductivity materials, with high thermal conductivity and low thermal resistance, which can quickly conduct the heat inside the power supply and effectively prevent the performance degradation or damage caused by overheating. At the same time, it also has excellent electrical insulation performance, can prevent short circuit and leakage between the internal circuits of the power supply, to ensure the safe operation of the power supply. In addition to heat dissipation and electrical insulation, TIS thermal potting adhesives also provide excellent resistance to moisture, dust and corrosion. It is able to seal the electronic components inside the power supply and prevent moisture, dust and corrosive substances from invading, thus extending the service life of the power supply and improving the overall reliability of the equipment.

 

latest company news about TIS thermal conductive potting adhesive: provides a solid backing for heat dissipation and protection of power supply  0

Features of thermal conductivity potting adhesive:

 

Good thermal conductivity: 1.0W-2.8W/mK

Good insulation performance, smooth surface

Low rate of contraction

Low viscosity, easy gas emission

Good solvent resistance and waterproof performance

Longer working hours

Excellent thermal shock resistance

latest company news about TIS thermal conductive potting adhesive: provides a solid backing for heat dissipation and protection of power supply  1

In practical application, TIS thermal conductivity potting adhesive shows good performance. It can not only adapt to various harsh working environments, but also maintain stable thermal conductivity and protection effect for a long time. TIS thermal potting adhesives provide reliable power supply protection in high temperature, high humidity, high vibration and strong electromagnetic interference environments.

In addition, the construction of TIS thermal potting adhesive is also very simple. It has good fluidity and curing speed, and can quickly fill the gaps and cavities inside the power supply to form a tight package layer. This not only improves the heat dissipation efficiency of the power supply, but also reduces the construction difficulty and cost.

latest company news about TIS thermal conductive potting adhesive: provides a solid backing for heat dissipation and protection of power supply  2

 

To sum up, TIS thermal potting adhesive provides a solid backing for power supply with its good thermal conductivity and protection ability. It is an indispensable and important part of modern electronic equipment, which provides a strong guarantee for the stable operation and reliable performance of equipment.

Pub Time : 2024-11-29 14:53:49 >> News list
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