What should be done if there is a gap between the component and the heat sink? Thermal conductive silicone sheet gives you the answer.
In the design and assembly of electronic devices, are you often troubled by a seemingly minor yet significant issue - the inevitable air gap between components and heat sinks? This gap is the "arch-nemesis" of heat conduction! Today, we will reveal the solution to this problem for you: thermal silicone pads.
On the path to achieving effective heat dissipation, engineers often encounter a classic "last millimeter" challenge: carefully selecting high-performance CPUs, power devices, and heat sinks, but due to the inability to achieve a perfectly flat contact between their surfaces, tiny air gaps are formed. Did you know that air is a poor conductor of heat, with a thermal conductivity of only about 0.026 W/(m•K)? These seemingly insignificant gaps can create a huge thermal resistance, like building an "insulating wall" in the heat dissipation path, causing a rapid accumulation of heat, a sharp rise in the core temperature of components, and leading to performance throttling, reduced stability, and even premature failure of the equipment. So, how can we effectively "bridge" this gap and establish a path for heat conduction? The answer is - thermal silicone pads. They are not ordinary materials but engineering masterpieces specifically designed to solve interface heat dissipation problems.
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Why is the thermal conductive silicone sheet considered a "great solution"?
Outstanding gap-filling ability: The thermal conductive silicone sheet is soft in texture, highly compressible and highly compliant. Under pressure, it can easily fill the uneven surfaces and microscopic gaps between components and heat sinks, expelling the air trapped within, and replacing the low thermal conductivity of air with high thermal conductivity solid material, thereby significantly reducing contact thermal resistance.
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In conclusion, when the "enthusiasm" of components has nowhere to go and the efficiency of heat sinks is compromised by gaps, choosing a reliable thermal silicone pad means choosing efficiency, stability and peace of mind. It effectively solves the classic problem of heat dissipation at the thermal interface and serves as an indispensable "bridge" between heat sources and heat sinks.
Contact Person: Ms. Dana Dai
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