Effective cooling, limitless computing power | Ziitek sincerely invites you to attend the three major industry events in Shenzhen

Dear Partner:

Hello!

Dongguan Ziitek Electronical Material and Technology Ltd. sincerely invites you to attend the three industry trade fairs to be held from June 10th to 12th, 2026 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). Our booth location: Hall 14, Booth 14H87 (Halls 14 and 16).

This grand event brings together three core exhibitions:

• Shenzhen International AI Computing Power Industry Exhibition
• The 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition
• The 16th Shenzhen International Heat Conductive and Heat Dissipation Materials and Equipment Exhibition (CIME 2026)

During the three exhibitions, the total exhibition area exceeded 40,000 square meters, gathering over 500 leading enterprises in the industry. It is expected to attract 30,000+ professional visitors. Simultaneously, 30 high-end technical forums will be held. As a highly influential event in the thermal management industry in South China, it comprehensively covers three major tracks: AI computing power, liquid cooling heat dissipation, and thermal conductive materials.

Choose Ziitek and unlock professional thermal management solutions

With a 20-year history in the field of electronic heat dissipation materials, Ziitek adheres to the development mission of "finding the best solution for every degree of heat". The core technical team comes from the Chinese Academy of Sciences and leading semiconductor enterprises, holding over 40 invention patents. Their products have all passed international authoritative certifications such as UL, RoHS, and REACH.

We focus on high-performance thermal interface materials, customized liquid cooling solutions, and AI chip-level thermal management services. We have served over 200 data centers, computing clusters, and consumer electronics enterprises, helping customers improve equipment efficiency by 15% to 30%, and laying a solid foundation for the stable operation of high-load equipment.

Three major new products make their debut at the event

• ✅ High thermal conductivity silicone sheet | Thermal conductivity reaches 16W/mK, suitable for AI servers and high-power chips, providing efficient and long-lasting heat dissipation
• ✅ Carbon fiber heat transfer pad | Thermal conductivity exceeds 25W/mK, featuring lightweight and high strength, suitable for demanding scenarios such as new energy vehicles and aerospace
• ✅ High thermal conductive gel | Thermal conductivity is 15W/mK, with excellent fluidity, capable of adapting to irregular gaps, suitable for 5G base stations and high-density consumer electronics

Throughout the exhibition, a professional technical team is on-site to provide services, offering one-on-one free customized thermal management solutions to address various industry challenges such as computing power heat dissipation and liquid cooling selection.

Exhibition Details:

♦ Exhibition Date: June 10th - 12th, 2026

♦ Exhibition Venue: Shenzhen International Convention and Exhibition Center (Bao'an New Hall), Hall 14 & 16

♦ Booth Number: 14H87

Scan the code immediately to make an appointment. You will enjoy priority reception and an exclusive exquisite gift!

We are looking forward to meeting you in person and exploring new opportunities in the field of cooling and computing power together!

Dongguan Ziitek Electronical Material and Technology Ltd.

Sincerely invites