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Black Thermally Conductive Potting Compound , Two Compound Thermal Conductive Epoxy Glue

Black Thermally Conductive Potting Compound , Two Compound Thermal Conductive Epoxy Glue

  • Black Thermally Conductive Potting Compound , Two Compound Thermal Conductive Epoxy Glue
  • Black Thermally Conductive Potting Compound , Two Compound Thermal Conductive Epoxy Glue
Black Thermally Conductive Potting Compound , Two Compound Thermal Conductive Epoxy Glue
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TIE280-25AB
Payment & Shipping Terms:
Minimum Order Quantity: 5can
Price: USD 1-50 / can
Packaging Details: 1kg/can
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 100000can/month
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Detailed Product Description
Usage: Potting Package: 1kg/can
Shelf Life @25℃ In Sealed Container: 12month Color: Black
Name: Two Compound Thermal Conductive Epoxy Glue Material: Epoxy Glue
High Light:

circuit board potting compound

,

high voltage potting compound

Ziitek high conductivity black two compound thermal conductive epoxy glue 85shoreD for potting coils

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.

 

Features

 

> Good thermal conductive: 2.5W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance

 

Application

 

Handheld portable electronics
Semiconductor automated test equipment (ATE)
CPU
display card
mainboard/mother board
notebook
power supply
Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes

 

Typical Uncured Material TIE™ 280-25A (Resin)
Color Black
Viscosity@25℃ Brookfield 3,000 cPs
Specific Gravity 2.1 g/cc
Shelf life @25℃ in sealed container 12 months
                                       TIE™ 280-25B (Hardener)
Color Black
Viscosity@25℃ Brookfield 5,000 cPs
Shelf life @25℃ in sealed container 12 months n

 

Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃) 45 min
Specific Gravity 2.1g/ccn
Cure Schedule
Cure 12 hours at 25℃
Cure 30 minutes at 70℃

 

Cured Properties
Hardness @25℃ 85 Shore D
Service temperature -40℃ to +130℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Coefficient of thermal expansion, / ℃ 3.0 X 10-5
Fire resistance UL Meet 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃ 0.1

 

Thermal
Thermal Conductivity 2.5 W/m-K
Thermal Impedance @10psi 0.31 ℃-in²/W
ELECTRICAL AS CURED
Dielectric Strength 300 volts / mil
Dielectric Constant 4.2 MHz
Dissipation factor 0.029 MHz
Volume resistivity, ohm-cm @ 25℃ 3.0 X 1012

 

Black Thermally Conductive Potting Compound , Two Compound Thermal Conductive Epoxy Glue 0

 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Sales Manager

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)

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