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3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package

3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package

    • 3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package
    • 3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package
  • 3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package

    Product Details:

    Place of Origin: China
    Brand Name: Ziitek
    Certification: UL
    Model Number: TIF030-05

    Payment & Shipping Terms:

    Minimum Order Quantity: 1000tube
    Price: 0.1-100USD/KG
    Packaging Details: 300cc/tube
    Delivery Time: 3-8 WORK DAYS
    Payment Terms: T/T
    Supply Ability: 10000KG/MONTH
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    Detailed Product Description
    Application: BGA Package Color: Light Blue
    Made By: Silicon Oil Keyword: Thermally Conductive Putty For BGA Putty
    Viscosity: 2000,000cps

    3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package

     

    TIF030-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF100-15 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
    TIF030-05  operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-15 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
     
    Application
     
    > Heat-sink & frame
    > LED backlight module,LED lighting
    > High speed hardware driver
    > Micro heat pipe ,Vihicel enginee controler
    > Telecom industry
     
    Feature
     
    > Thermal conductivity:  3W/mK
    > Soft, very low compression
    > Operate automaticly

     

     

    TIFTM030-05 Property
    Color Blue Visual
    Construction & Composition Ceramic filled silicon material **********
    Viscosity 2000,000cps GB/T 10247
    Specific Gravity 2.95 g/cc ASTM D297
    Thermal conductivity 3.0 W/mK ISO 22007-2
    Thermal diffusivity 1.053 mm2/s ISO 22007-2
    Specific heat capacity 3.2 MJ/m3K ISO 22007-2
    Continuous Use Temperature -45 ~200°C ******
    Dielectric breakdown strength 200 V/mil ASTM D149
    Flame Rating 94V0 E331100
    Outgassing,%TML 0.80% ASTM E595
     

    30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

    We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.

     

     

    3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package

    Contact Details
    Dongguan Ziitek Electronic Materials & Technology Ltd

    Contact Person: Sales Manager

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