Name: High Cost-Effective Outstanding Thermal Performance Thermal Gap Pad Green 1.5W/MK For CPU
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF160-07E Series
Price: 4.10 USD
Availability: InStock

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High Cost-Effective Outstanding Thermal Performance Thermal Gap Pad Green 1.5W/MK For CPU

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF160-07E Series

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	High Cost-Effective Outstanding Thermal Performance Thermal Gap Pad Green 1.5W/MK For CPU	Thickness Range:	1.5mm
Keywords:	Thermal Gap Pad	Color:	Green
Dielectric Constant @ 1MHz:	4.7	Breakdown Voltage(V/mm):	≥5500
Flame Rating:	94 V-0	Thermal Conductivity:	1.5W/m-K
Application:	CPU,Aluminum Battery, 5G Phone	Sample:	Sample Free
Highlight:	High Tack Surface Thermal Gap Filler , 1.5W/MK Thermal Gap Filler , 2.15g/cc thermal gap filler pad

High Cost-Effective Outstanding Thermal Performance Thermal Gap Pad Green 1.5W/MK For CPU

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIF^®160-07E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features

> Good thermal conductive: 1.5W/mK

> RoHS compliant
> Available in varies thickness
> UL recognized

> Easy release construction
> Broad range of hardnesses available

> High tack surface reduces contact resistance
> Soft and Compressible for low stress applications
> Outstanding thermal performance

Applications

> LED TV / LED Lit Lamps
> Automotive engine control units
> SAD-DC Power Adapters
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Micro heat pipe thermal solutions
> Memory Modules

> Routers

> Telecommunication hardware

> Mainboard/mother board

Typical Properties of TIF^®100-07E Series
Property	Value		Test method
Color	Green		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.1		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness (Shore 00)	65	35	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.7 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	1.5 W/m-K		ASTM D5470
	1.5 W/m-K		ISO22007

Product Specification

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm)with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High Cost-Effective Outstanding Thermal Performance Thermal Gap Pad Green 1.5W/MK For CPU 0

Advantage

Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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High Cost-Effective Outstanding Thermal Performance Thermal Gap Pad Green 1.5W/MK For CPU

High Cost-Effective Outstanding Thermal Performance Thermal Gap Pad Green 1.5W/MK For CPU

High Tack Surface Thermal Gap Filler

1.5W/MK Thermal Gap Filler

2.15g/cc thermal gap filler pad

heat conductive pad,

gap filler pad,

thermal cooling pad