Name: 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-10-01U Series
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF100-10-01U Series

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	242312cm cantons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application	Thickness:	0.5~5.0mm
Specific Gravity:	2.1 G/cc	Dielectric Breakdown Voltage:	>5000 VAC
Thermal Conductivity:	1.0W/m-K	Keywords:	Silicone Thermal Pad
Hardness:	27 ShoreA	Application:	High Temperature Application
Highlight:	1.5W/m-K Thermal Gap Filler , 27 Shore 00 Thermal Gap Filler , 94 V0 Rubber Silicone Thermal Pad

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

The TIF100-10-01U Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-10-01U-TDS_EN_REV02-.pdf

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application 0

Features
> Good thermal conductive: 1.0W/mK
> RoHS compliant
> UL recognized
> Tear resistance
> Easy release construction
> Electrically isolating
> High durability

Applications
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

Typical Properties of TIF100-10-01U Series
Color	Dark gray	Visual
Construction &Compostion	Ceramic filled silicone elastomer	***
Specific Gravity	2.1g/cc	ASTM D297
Thickness range	0.020"(0.5mm)~0.200"(5.0mm)	ASTM C351
Hardness	27 Shore 00	ASTM 2240
Dielectric Breakdown Voltage	>5000 VAC	ASTM D412
Continuos Use Temp	-40 to 160℃	***
Outgassing(TML)	0.35%	ASTM E595
Dielectric Constant	4.5 MHz	ASTM D150
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257
Fire rating	94 V0	equivalent UL
Thermal conductivity	1.0W/m-K	ASTM D5470

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application 1

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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