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1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF100-10-01U Series
Document: TIF100-10-01U_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application Thickness: 0.25~5.0mm(0.010"~0.200")
Density: 2.0 G/cm³ Breakdown Voltage: ≥5500
Thermal Conductivity: 1.0W/m-K Keywords: Silicone Thermal Pad
Hardness(Shore 00_): 65/27 Application: High Temperature Application
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1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application
Product Overview

The TIF®100-10-01U Series thermal gap filler pads utilize a specialized manufacturing process with silicone as the base material, incorporating thermal conductive powder and flame retardant additives to create an effective thermal interface material. This formulation significantly reduces thermal resistance between heat sources and heat sinks.

Product Image
TIF®100-10-01U Series Thermal Gap Filler Pad
Key Features
Excellent thermal conductivity: 1.0W/mK
RoHS compliant
UL recognized
Tear resistant construction
Easy release application
Electrically isolating properties
High durability and reliability
Applications
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • CPU cooling solutions
  • Display card thermal management
  • Mainboard/motherboard applications
  • Home appliance industry
  • Power module thermal regulation
  • Wearable device thermal control
  • Solar photovoltaic panel systems
  • LED lighting fixtures
Technical Specifications
Property Value Test Method
Color Black Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.0 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shroe 00) 65 | 27 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.0 W/m-K
1.0 W/m-K
ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes
  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Additional Product Image
TIF® Series Thermal Pad Packaging and Application
Packaging & Lead Time
Packaging Details
  • PET film or foam protection
  • Paper card separation between layers
  • Export carton packaging (inside and outside)
  • Customized packaging available per customer requirements
Lead Time

Quantity: 5000 pieces

Estimated Time: To be negotiated

Frequently Asked Questions
Q: Are you a trading company or manufacturer?
A: We are a manufacturer based in China.
Q: How long is your delivery time?
A: Generally 3-7 work days for in-stock items, or 7-10 work days for non-stock items, depending on quantity.
Q: Do you provide samples? Is it free or extra cost?
A: Yes, we offer samples free of charge.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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