Name: 1.5W/Mk High Performance Thermal Gap Pad For Memory Modules
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1100-02F Series
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

1.5W/Mk High Performance Thermal Gap Pad For Memory Modules

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF1100-02F Series

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	242312cm cantons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

Contact Now

Detailed Product Description

Construction & Compostion:	Ceramic Filled Silicone Elastomer	Specific Gravity:	2.23 G/cc
Hardness:	55 Shore 00	Name:	Silicone Thermal Pad TIF1100-02F Series
Volume Resistivity:	4.0X10" Ohm-meter	Thermal Conductivity:	1.5W/m-K
Highlight:	1.5W/Mk Thermal Gap Filler Pad , Thermal Gap Pad For Memory Modules , UL Thermal Gap Filler Pad

New type Outstanding thermal performance thermal gap pad for Memory Modules

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

The TIF1100-02F Series maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography.

Features

Available in varies thicknesses

Broad range of hardnesses available

Moldability for complex parts

Outstanding thermal performance

High tack surface reduces contact resistance

RoHS compliant

Applications

notebook

power supply

Heat pipe thermal solutions

Memory Modules

Mass storage devices

Automotive electronics

Set top boxes

Audio and video components

IT infrastructure

GPS navigation and other portable devices

CD-Rom, DVD-Rom cooling

Typical Properties of TIF1100-02F Series
Color	Gray white	Visual	Composite Thickness	Thermal Impedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific Gravity	2.23 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness range	0.010"-0.200"	ASTM C351	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	55 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Dielectric Breakdown Voltage	>1000 VAC	ASTM D412	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Outgassing(TML)	0.30%	ASTM E595	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	5.5 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	4.0X10" Ohm-meter	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	1.5W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

16" x 18"(406mm x 457mm)

TIF™ series Individual die cut shapes can be supplied.

1.5W/Mk High Performance Thermal Gap Pad For Memory Modules 0

TIF100-02F-Datasheet-REV02.pdf

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units

Products name: Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units

Application: automotive Engine Control Units

Feature: Soft and Naturally tacky needing no further adhesive coating

Hardness: 45 Shore 00

Compressible Silicone Thermal Pad TIF840HP High Conductivity Micro Heat Pipe Thermal Solutions

color: grey

thermal conductivity: 12 W/mK

application: RDRAM Memory Modules

name: Silicone Thermal Pad

China Manufacturer High Thermal Conductivity 12W Gray Silicone Thermal Pad

color: gray

thermal conductivity: 12 W/mK

Hardness(shore00 Thinkness＜0.75mm): 40

price: factory price

Garnet Telecommunication Hardware Naturally Tacky 6.2 W Silicon Thermal Pad 0.25-5.08mm Thickness

color: garnet

thermal conductivity: 6.2W/mK

lead time: 3-7 work days

thickness: 0.25-5.08mm

Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad

Product ame: Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad

Thickness: 1.0mmT

Specific Gravity: 3.0g/cc

Dielectric Breakdown Voltage: >5500 VAC

1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads

Product ame: 1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads

Thickness: 0.5mmT

Specific Gravity: 2.3 g/cc

Dielectric Breakdown Voltage: >5000 VAC

High Thermal Conductivity Customizable Thickness Soft Thermal Pad For CPU GPU Cooling Specific Gravity 2.7g/cm3

Products name: High Thermal Conductivity Customizable Thickness Soft Thermal Pad For CPU GPU Cooling

Thermal Conductivity: 2.0 W/mK

Hardness: 27±5 Shore 00

Keywords: Thermal Pad

1.5W/Mk High Performance Thermal Gap Pad For Memory Modules

1.5W/Mk High Performance Thermal Gap Pad For Memory Modules

1.5W/Mk Thermal Gap Filler Pad

Thermal Gap Pad For Memory Modules

UL Thermal Gap Filler Pad

heat conductive pad,

gap filler pad,

thermal cooling pad