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3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure 

3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure 

  • 3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure 
  • 3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure 
3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure 
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF5120-18-11US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Hardness: 25shore00 KEYWORD: Grey Silicone Rubber Pads
Color: Grey Part Number: TIF5120-18-11US
Material: Silicone Thermal Conductive​: 1.8 W/mK
High Light:

Thermal Gap Pad 3.0mmT


IT Infrastructure Thermal Gap Pad


25shore00 Thermal Gap Pad

3.0mmT high cost-effective thermal gap pad 1.8 W/MK 25shore00 For IT infrastructure


Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


TIF500-18-11US Datasheet-REV02.pdf

Ziitek TIF5120-18-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

<Good thermal conductive: 1.8 W/mK


< release construction

<Outstanding thermal performance

<Soft and compressible for low stress applications

<Naturally tacky needing no further adhesive coating


<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling

<Semiconductor automated test equipment (ATE)


<display card

<mainboard/mother board




Typical Properties of  TIF5120-18-11US  
Product Name
TIF5120-18-11US Series


Construction & Compostion
Ceramic filled silicone rubber
Specific Gravity
2.8 g/cc
Dielectric Constant@1MHz
4.2 MHz
20 Shore 00
Flame Rating
94 -V0
Continuos Use Temp
-40 to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
1.8 W/mK


Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.


Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.




Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure  0

Ziitek Culture


Quality :

Do it right the first time, total quality control


Work precisely and thoroughly for effectiveness


Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.



Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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