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Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT

Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT

  • Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT
  • Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT
Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF160-30-11US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Hardness: 20±5 Shore00 KEYWORD: Gray Silicone Rubber Pads
Color: Gray Part Number: TIF160-30-11US
Material: Silicone Thickness: 1.5mmT
High Light:

20±5 Shore00 Thermal Gap Pad

,

Mass Storage Devices Thermal Gap Pad

,

thermal gap filler pad 1.5mmT

High cost-effective thermal gap pad for Mass storage devices ,20±5 shore00,1.5mmT


Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

TIF100-30-11US-Series-Datasheet-.pdf

 
TIF160-30-11US  is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling Ziitek TIF160-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. Ziitek TIF160-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request
 
Features
<Good thermal conductive:3.0W/mK
<Thickness:1.5mmT
<Hardness:20±5  Shore 00
<Colour: gray

<Fiberglass reinforced for puncture, shear and tear resistance

<Easy release construction

 
Applications

<Mass storage devices

<Automotive electronics

<Set top boxes

<Micro heat pipe thermal solutions

<Automotive engine control units

<Telecommunication hardware


 

 
Typical Properties of TIF160-30-11US
 
Product Name  

 TIF160-30-11US Series

Colour
gray 
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

1.5mmT
Hardness
 20±5Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
 3.0W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

 

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

 

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

 
Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract


FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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