Send Message
Home ProductsCPU Thermal Pad

Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity

Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity

Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity
video
Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF180-30-06US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
Contact Now
Detailed Product Description
Hardness: 18 Shore00 KEYWORD: White Silicone Rubber Pads
Color: White Part Number: TIF180-30-06US
Material: Silicone Thermal Conductive: 3.0W/mK
High Light:

power supply cpu thermal pad

,

conductivity 3 w mk cpu thermal pad

,

power supply thermal pad for cpu

Moldability for complex parts UL recognized thermal pad for power supply,2.0mmT

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

TIF100-30-06US.pdf

 
TIF180-30-06US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
 
<Good thermal conductive:3.0W/mK
<Thickness:2.0mmT
<Hardness:18 Shore 00
<Colour: white

<RoHS compliant

<UL recognized

<Fiberglass reinforced for puncture, shear and tear resistance

 
Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

 

 


 

 
Typical Properties of TIF180-30-06US
 
Product Name  

TIF180-30-06US Series

Colour
white
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

2.0mmT
Hardness
18 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity 0
Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity 1

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity 2
 
FAQ

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

Other Products