Send Message
Home ProductsCPU Thermal Pad

Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk

Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk

  • Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk
  • Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk
Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1200-30-06US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
Contact Now
Detailed Product Description
Hardness: 18 Shore00 KEYWORD: White Silicone Rubber Pads
Color: White Part Number: TIF1200-30-06US
Material: Silicone Thermal Conductive: 3.0W/mK
High Light:

telecommunication hardware cpu thermal pad

,

3.0 w/mk cpu thermal pad

,

telecommunication hardware thermal pad for cpu

Outstanding thermal performance Available in varies thicknesses silicone pads for LED Controller,4.5mmT

 

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 
TIF100-30-06US.pdf

 
TIF1200-30-06US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
 
<Good thermal conductive:3.0W/mK
<Thickness:5.0mmT
<Hardness:18 Shore 00
<Colour: white

<Easy release construction

<Electrically isolating

<High durability

 
Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

 


 

 
Typical Properties of TIF1200-30-06US
 
Product Name  

TIF1200-30-06US Series

Colour
white
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

5.0mmT
Hardness
18 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk 0
 

 

 

Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

 

Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk 1
 
FAQ

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

Other Products