Send Message
Home ProductsCPU Thermal Pad

Silicone 3.5mmt Cpu Thermal Pad For Memory Modules

Silicone 3.5mmt Cpu Thermal Pad For Memory Modules

  • Silicone 3.5mmt Cpu Thermal Pad For Memory Modules
  • Silicone 3.5mmt Cpu Thermal Pad For Memory Modules
Silicone 3.5mmt Cpu Thermal Pad For Memory Modules
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1140-50-11US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
Contact Now
Detailed Product Description
Hardness: 20 Shore00 Volume Resistiviyt: 1.0*1012 Ohm-cm
Thermal Conductive: 5.0W/mK Part Number: TIF1140-50-11US
Specific Gravity: 2.9 G/cc Color: Gray
High Light:

3.5mmt cpu thermal pad


memory modules cpu thermal pad


memory modules thermal conductive silicone pad

High tack surface reduces contact resistance silicone pads for Memory Modules ,3.5mmT


Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


TIF1140-50-11US  is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
<Good thermal conductive:5.0W/mK
<Hardness:20 Shore 00
<Colour: gray

<Available in varies thicknesses

<Broad range of hardnesses available

<Moldability for complex parts


<mainboard/mother board


<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices



Typical Properties of TIF1140-50-11US
Product Name 

TIF1140-50-11US Series

Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

2.9 g/cc


20 Shore 00
Dielectric constant@1MHz
4.2 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
5.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm


Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)


Consult the factory to alternate thickness.


Silicone 3.5mmt Cpu Thermal Pad For Memory Modules 0



Ziitek Culture


Quality :

Do it right the first time, total quality control


Work precisely and thoroughly for effectiveness


Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.



Silicone 3.5mmt Cpu Thermal Pad For Memory Modules 1

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

Other Products