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3.15g/Cm3 No Further Adhesive Coating Cpu Thermal Pad Silicone

3.15g/Cm3 No Further Adhesive Coating Cpu Thermal Pad Silicone

3.15g/Cm3 No Further Adhesive Coating Cpu Thermal Pad Silicone
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3.15g/Cm3 No Further Adhesive Coating Cpu Thermal Pad Silicone
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1100-40-11US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Density: 3.15g/cm3 Color: Gray
Volume Resistiviyt: 6.0*1012 Ohm-cm Thermal Conductive: 4.0W/mK
Hardness: 20 Shore00 Name: No Further Adhesive Coating Cpu Thermal Pad Silicone 3.15g/Cm3
Highlight:

3.15g/cm3 cpu thermal pad

,

adhesive coating cpu thermal pad

,

3.15g/cm3 thermal conductive silicone pad

Naturally tacky needing no further adhesive coating silicone pads for CPU

 

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


TIF100-40-11US-Series-Datasheet.pdf

 
TIF1100-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
 
<Good thermal conductive:4.0W/mK
<Thickness:2.5mmT
<Hardness:20 Shore 00
<Colour: gray

<Moldability for complex parts

<Soft and compressible for low stress applications

<Naturally tacky needing no further adhesive coating

 
Applications

<Waterproof LED Power

<SMD LED module

<LED Flesible strip, LED bar

<LED PanelLight

<LED floor light

<Routers

 


 

 
Typical Properties of TIF1100-40-11US
 
Product Name 

TIF1100-40-11US Series

Colour
gray
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.15 g/cc

Thickness

2.5mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
4.0 W/mK
Volume Resistiviyt

6.0*1012 Ohm-cm

 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 

TIF™ series Individual die cut shapes can be supplied.

 

3.15g/Cm3 No Further Adhesive Coating Cpu Thermal Pad Silicone 0
 

 

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

 

 

3.15g/Cm3 No Further Adhesive Coating Cpu Thermal Pad Silicone 1
 
FAQ

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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