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Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

  • Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure
  • Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure
Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1140-40-11US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Application: Display Card Thermal Conductive: 4.0W/mK
Density: 3.15g/cm3 Hardness: 20 Shore00
Name: Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure Keyword: Thermal Gap Pad
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Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


TIF100-40-11US-Series-Datasheet.pdf

 
TIF1140-40-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
 
<Good thermal conductive:4.0W/mK
<Thickness:3.5mmT
<Hardness:20 Shore 00
<Colour: gray

<Outstanding thermal performance

<High tack surface reduces contact resistance

<RoHS compliant

 
Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

 


 

 
Typical Properties of TIF1140-40-11US
 
Product Name 

TIF1140-40-11US Series

Colour
gray
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.15 g/cc

Thickness

3.5mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
4.0 W/mK
Volume Resistiviyt

6.0*1012 Ohm-cm

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure 0
 

 

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure 1
 
FAQ

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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