Name: 2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF180-30-05US thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF180-30-05US thermal pad

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

Contact Now

Detailed Product Description

Products Name:	2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics	Thermal Conductive:	3.0W/mK
Dielectric Constant @1MHz:	7.0	Continuos Use Temp:	-40 To 200℃
Application:	Automotive Electronics	Density:	3.0 G/cm³
Keywords:	CPU Thermal Pad	Construction:	Ceramic Filled Silicone Elastomer
Color:	Blue
Highlight:	2.0mmt cpu thermal pad , set top boxes cpu thermal pad , silicone pad thermal conductivity 3.0 w mk

2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

TIF^®180-30-05US thermal pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.

Features:

> Good thermal conductive: 3.0 W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Typical Properties of TIF^®100-30-05US Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	50 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.0 W/m-K		ASTM D5470
	3.0 W/m-K		ISO22007

Product Specification

Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Independent R&D team

Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online

FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

High Thermal Conductive 8.5W/MK Thermal Management Materais Thermal Pad For Computer CPU/GPU Cooling

Products name: High Thermal Conductive 8.5W/MK Thermal Management Materais Thermal Pad For Computer CPU/GPU Cooling

Thickness range: 0.012"(0.30mm)~0.200"(5.0mm)

Hardness: 35/20 shore00

Keywords: Thermal Management materais

Thermal Management 6.0W Thermal Gap Pads For AI Processors AI Servers

Products name: Thermal Management 6.0W Thermal Gap Pads For AI Processors AI Servers

Thickness range: 0.010"(0.25mm)~0.200"(5.0mm)

Hardness: 65/20 shore00

Keywords: Thermal gap pads

Soft And Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers

Products name: Soft And Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers

Hardness: 65/27 shore00

Keywords: Electrically Insulating Pad

Color: Dark Gray

3.0 W/Mk Thermal Conductivity Silicone thermal Pad For Heat Pipe Thermal Solutions

Products name: 3.0 W/Mk Thermal Conductivity Silicone thermal Pad For Heat Pipe Thermal Solutions

Hardness: 65/20 shore00

Keywords: Silicone thermal Pad

Color: White

3.0W/Mk High Effective Silicone Gap Filler Pad CPU Pad Blue Color For Power Supply

Products Name: 3.0W/Mk High Effective Silicone Gap Filler Pad CPU Pad Blue Color For Power Supply

Dielectric Constant: 7.0 MHz

Color: blue

Density: 3.0 g/cm³

Fiberglass Reinforced Excellent Insulator Silicone Cpu Thermal Pad For Smd Led Module

Products Name: Fiberglass Reinforced Excellent Insulator Silicone Cpu Thermal Pad For Smd Led Module

Application: Notebook SMD LED module

Continuos Use Temp: -40 to 200℃

Color: blue

1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure

Products Name: 1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure

Application: IT infrastructure

Dielectric constant: 7.0 MHz

Continuos Use Temp: -40 to 200℃

2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics

2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics

2.0mmt cpu thermal pad

set top boxes cpu thermal pad

silicone pad thermal conductivity 3.0 w mk

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad