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RoHS Compliant 3.0mmt Thermal Gap Pad For Infrastructure Cpu Thermal Pad

RoHS Compliant 3.0mmt Thermal Gap Pad For Infrastructure Cpu Thermal Pad

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1120-30-05US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Products Name: RoHS Compliant 3.0mmt Thermal Gap Pad For Infrastructure Cpu Thermal Pad Certifications: IATF16949
Application: Infrastructure Cpu Thermal Pad Thickness: 3.0mmT
Keyword: Thermal Gap Pad Continuos Use Temp: -40 To 200℃
Thermal Conductivity: 3.0W/mK Construction: Ceramic Filled Silicone Elastomer
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RoHS Compliant 3.0mmt Thermal Gap Pad For Infrastructure Cpu Thermal Pad

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 
TIF®1120-30-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

Features:

 

> RoHS compliant 1.5 W/mK
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance3 W/mK
> Easy release construction
> Electrically isolating
> High durability


Applications:

 

> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

 

Typical Properties of TIF®100-30-05US Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 50 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007
 

Product Specification

 

Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)

 

Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

RoHS Compliant 3.0mmt Thermal Gap Pad For Infrastructure Cpu Thermal Pad 0
Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

RoHS Compliant 3.0mmt Thermal Gap Pad For Infrastructure Cpu Thermal Pad 1
FAQ

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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