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3.0mmt It Infrastructure Cpu Thermal Pad Rohs

3.0mmt It Infrastructure Cpu Thermal Pad Rohs

3.0mmt It Infrastructure Cpu Thermal Pad Rohs
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3.0mmt It Infrastructure Cpu Thermal Pad Rohs
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1120-30-05US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Certifications: IATF16949 Application: Routers
Thickness: 3.0mmT Keyword: Thermal Gap Pad
Name: 3.0mmT Good Thermal Conductive Thermal Gap Pad For IT Infrastructure ,RoHS Continuos Use Temp: -40to 160℃
High Light:

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Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


TIF100-30-05US-Series-Datasheet.pdf

 
TIF1120-30-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

 
<Good thermal conductive:3.0W/mK
<Thickness:3.0mmT
<Hardness:18 Shore 00
<Colour: blue

<Available in varies thicknesses

<Broad range of hardnesses available

<Moldability for complex parts

 
Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

 
Typical Properties of TIF1120-30-05US
 
Product Name 

TIF1120-30-05US Series

Colour
blue
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

3.0mmT
Hardness
18 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

 
 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

3.0mmt It Infrastructure Cpu Thermal Pad Rohs 0
 

 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

3.0mmt It Infrastructure Cpu Thermal Pad Rohs 1
 
FAQ

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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