Name: Thermal Conductivity 3.0W/M·K Thermal Conductive Silicone Pad For Mass Storage Devices
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1140-30-05US thermal pad
Price: 4.10 USD
Availability: InStock

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Thermal Conductivity 3.0W/M·K Thermal Conductive Silicone Pad For Mass Storage Devices

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF1140-30-05US thermal pad

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Products Name:	Thermal Conductivity 3.0W/M·K Thermal Conductive Silicone Pad For Mass Storage Devices	Continuos Use Temp:	-40 To 200℃
Application:	Mass Storage Devices	Thickness:	3.5mmT
Keyword:	Thermal Conductive Silicone Pad	Certifications:	ISO9001：2015
Construction:	Ceramic Filled Silicone Elastomer
Highlight:	3.5mmt thermal conductive silicone pad , iatf16949 thermal conductive silicone pad , mass storage devices silicone thermal pads

Thermal Conductivity 3.0W/M·K Thermal Conductive Silicone Pad For Mass Storage Devices

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

TIF^®1140-30-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

> Thermal conductivity: 4.5 W/m·K
> Excellent insulator
> Reworkable
> Fiberglass reinforced

Applications

> mainboard/mother board

> notebook

> power supply

> Heat pipe thermal solutions

> Memory Modules

> Mass storage devices

Typical Properties of TIF^®100-30-05US Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	50 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.0 W/m-K		ASTM D5470
	3.0 W/m-K		ISO22007

Product Specification

Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Thermal Conductivity 3.0W/M·K Thermal Conductive Silicone Pad For Mass Storage Devices 1
FAQ

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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Thermal Conductivity 3.0W/M·K Thermal Conductive Silicone Pad For Mass Storage Devices

Thermal Conductivity 3.0W/M·K Thermal Conductive Silicone Pad For Mass Storage Devices

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