Name: CPU Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-50-11S thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

CPU Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL and RoHs
Model Number:	TIF100-50-11S thermal pad
Document:	TIF100-50-11S_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm carton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

Contact Now

Detailed Product Description

Products Name:	CPU Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics	Model Number:	TIF100-50-11S
Keyword:	CPU Thermal Pad	Dielectric Constant@1MHz:	7.0
Breakdown Voltage(V/mm):	≥5500	Color:	Dark Gray
Thermal Conductiviry:	5.0W/mK	Application:	For Cooling Of Portable Electronics
Sample:	Free
Highlight:	rohs compliant cpu pad , 3.0 w mk cpu pad , 3.0 w mk thermal pad for cpu

CPU Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Products ddescription

Ziitek TIF^®100-50-11S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features:

> Good thermal conductive:5.0W/mK

> Thickness: 0.010~0.200 (0.25mm~5.0mmT)

> Colour: gray

> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications:

> Automotive engine control units

> Telecommunication hardware

> Handheld portable electronics

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

Key attributes

Typical Properties of TIF^®100-50-11S Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.15		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.0)
Hardness	65 Shore 00	45 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	5.0 W/m-K		ASTM D5470
	5.0W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

CPU Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics 0

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices

Products name: Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices

Model Number: TIF100-60-11U

Keyword: Silicone Thermal Pad

Dielectric constant@1MHz: 7.0

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Products name: Heat Transfer CPU Thermal Pad With 3.0W MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Part number: TIF100-32-05S

Hardness: 65/45 Shore 00

Thermal conductivity: 3.2W/mK

Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics

Products name: Thermal Conductive CPU Thermal Pad With 5.0W MK Gap Pad Material Suitable For Portable Electronics

Construction: Ceramic filled silicone elastomer

Keywords: CPU Thermal Pad

Thickness: 0.010~0.200inch(0.25mm~5.0mm)

3.0W/MK RoHS Compliant Thermal Conductive Gap Pad For Handheld Portable Electronics

Products name: 3.0W/MK RoHS Compliant Thermal Conductive Gap Pad For Handheld Portable Electronics

Hardness: 65/20 shore00

Keywords: hermal Conductive Gap Pad

Color: Dark gray

5.0mmT Effective CPU Thermal Pad Designed To Enhance Cooling Performance In High Speed Mass Storage Drives Applications

Products name: 5.0mmT Effective CPU Thermal Pad Designed To Enhance Cooling Performance In High Speed Mass Storage Drives Applications

Hardness: 65/20 shore00

Keywords: CPU Thermal Pad

Color: Dark gray

3.0W/MK 4.5mmT Silicone Thermal Pad For Heat Sinking Housing At LED Lit BLU In LCD

Products name: 3.0W/MK 4.5mmT Silicone Thermal Pad For Heat Sinking Housing At LED Lit BLU In LCD

Hardness: 65/20 shore00

Keywords: Silicone Thermal Pad

Color: gray

Silicone Based CPU Thermal Pad With 3.0 G/cm³ Density For Effective Heat Transfer And Electrical Isolation In LED Displays

Products name: Silicone Based CPU Thermal Pad With 3.0 G/cm³ Density For Effective Heat Transfer And Electrical Isolation In LED Displays

Hardness: 65/20 shore00

Keywords: CPU Thermal Pad

Color: Dark gray

CPU Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics

CPU Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics

rohs compliant cpu pad

3.0 w mk cpu pad

3.0 w mk thermal pad for cpu

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad