Name: Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-50-05E thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL and RoHs
Model Number:	TIF100-50-05E thermal pad
Document:	TIF100-50-05E_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm carton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Products Name:	Thermal Conductive CPU Thermal Pad With 5.0W MK Gap Pad Material Suitable For Portable Electronics	Construction:	Ceramic Filled Silicone Elastomer
Keywords:	CPU Thermal Pad	Thickness:	0.010~0.200inch(0.25mm~5.0mm)
Part Number:	TIF100-50-05E	Hardness:	65/35 Shore 00
Thermal Conductivity:	5.0W/mK	Color:	Blue
Sample:	Free	Application:	Portable Electronics

Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Products description

TIF^®100-50-05E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

> Good thermal conductive: 5.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

Key attributes

Typical Properties of TIF^®100-50-05E Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.4		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	35 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	6.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity (W/m-K)	5.0		ASTM D5470
	5.0		ISO22007

Product Specifications

Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

FAQ:

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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