Name: Silicone Based CPU Thermal Pad With 3.0 G/cm³ Density For Effective Heat Transfer And Electrical Isolation In LED Displays
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1160-30-11US thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

Silicone Based CPU Thermal Pad With 3.0 G/cm³ Density For Effective Heat Transfer And Electrical Isolation In LED Displays

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF1160-30-11US thermal pad
Document:	TIF100-30-11US_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm canton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

Contact Now

Detailed Product Description

Products Name:	Silicone Based CPU Thermal Pad With 3.0 G/cm³ Density For Effective Heat Transfer And Electrical Isolation In LED Displays	Hardness:	65/20 Shore00
Keywords:	CPU Thermal Pad	Color:	Dark Gray
Part Number:	TIF1160-30-11US	Material:	Ceramic Filled Silicone Elastomer
Thickness:	4.0mmT	Application:	Effective Heat Transfer And Electrical Isolation In LED Displays
Thermal Conductivity:	3.0W/mK
Highlight:	3.0 G/Cc Silicone Thermal Pad , 4.0 MHz thermal conductive silicone pad , 4.0 MHz Silicone Thermal Pad

Silicone Based CPU Thermal Pad With 3.0 G/cm³ Density For Effective Heat Transfer And Electrical Isolation In LED Displays

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Products description

TIF^®1160-30-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

>Good thermal conductive:3.0W/mK

>Thickness: 4.0mmT

>Hardness:65/20 Shore 00

>Colour: Dark gray

>Easy release construction
>Electrically isolating
>High durability

>Network communication products
>Electric vehicle batteries
>Computer CPU/GPU Cooling

Applications

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>Display card

>Mainboard/mother board

>Notebook

Key attributes

Typical Properties of TIF^®100-30-11US Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	7.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity (W/m-K)	3.0		ASTM D5470
	3.0		ISO22007

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

3.0W/MK RoHS Compliant Thermal Conductive Gap Pad For Handheld Portable Electronics

Products name: 3.0W/MK RoHS Compliant Thermal Conductive Gap Pad For Handheld Portable Electronics

Hardness: 65/20 shore00

Keywords: hermal Conductive Gap Pad

Color: Dark gray

5.0mmT Effective CPU Thermal Pad Designed To Enhance Cooling Performance In High Speed Mass Storage Drives Applications

Products name: 5.0mmT Effective CPU Thermal Pad Designed To Enhance Cooling Performance In High Speed Mass Storage Drives Applications

Hardness: 65/20 shore00

Keywords: CPU Thermal Pad

Color: Dark gray

3.0W/MK 4.5mmT Silicone Thermal Pad For Heat Sinking Housing At LED Lit BLU In LCD

Products name: 3.0W/MK 4.5mmT Silicone Thermal Pad For Heat Sinking Housing At LED Lit BLU In LCD

Hardness: 65/20 shore00

Keywords: Silicone Thermal Pad

Color: gray

Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues

Products name: Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues

Hardness: 65/20 shore00

Keywords: thermal pad

Color: Gray

CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment

Products name: CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment

Hardness: 65/20 shore00

Keywords: CPU Thermal Pad

Color: Dark gray

2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation

Products name: 2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation

Hardness: 65/20 shore00

Keywords: Thermal Pads

Color: Dark gray

CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components

Products name: CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components

Hardness: 65/20 shore 00

Keywords: CPU Thermal Pad

Color: Dark gray

Silicone Based CPU Thermal Pad With 3.0 G/cm³ Density For Effective Heat Transfer And Electrical Isolation In LED Displays

Silicone Based CPU Thermal Pad With 3.0 G/cm³ Density For Effective Heat Transfer And Electrical Isolation In LED Displays

3.0 G/Cc Silicone Thermal Pad

4.0 MHz thermal conductive silicone pad

4.0 MHz Silicone Thermal Pad

Key attributes

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad