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Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board

Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board

  • Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board
  • Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board
Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF140-20-10UF thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Hardness: 75 Shore 00 Thickness: 1.0mmT
Feature: Naturally Tacky Needing No Further Adhesive Coating Name: Specific Gravity 2.7 G/cc Good Thermal Conductive Conductive Pads For Mother Board
Color: Gray Keyword: Thermal Gap Pad
High Light:

2.7 G/Cc Heat Sink Thermal Pad

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Mother Board Heat Sink Thermal Pad

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2.7 G/Cc Thermal Pad For Heat Sink

Specific Gravity 2.7 g/cc Good thermal conductive Conductive Pads for Mother Board

 

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

TIF100-20-10UF-Datasheet-REV02.pdf

 

Ziitek TIF140-20-10UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


 

<Good thermal conductive: 2.0 W/mK
<Thickness: 1.0mmT
<Hardness:75 Shore 00
<Colour: gray

<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available
 

 

 

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

 

 
Typical Properties of TIF140-20-10UF
 
Product Name TIF140-20-10UF Series
Colour Gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity 2.7 g/cc
Thickness 1.0mmT
Hardness 75 Shore 00
Dielectric constant@1MHz 4.6 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 2.0W/mK
Volume Resistivity 1.0*1012 Ohm-cm

 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 

TIF™ series Individual die cut shapes can be supplied.

 

Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board 0
 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board 1
 
FAQ

Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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