Heat Sink Thermal Pad Engineered For Heat Transfer In Motherboards VGA Cards Notebooks And LED Server Power Applications

The Heat Sink Thermal Pad is engineered for efficient heat transfer across a wide range of electronic and industrial applications, including motherboards, VGA cards, notebooks, LED lighting, and server power systems. It reliably fills interface gaps, transfers heat, and provides mechanical support for stacked components while resisting compressive deformation.

Ziitek, founded in 2006, has been deeply involved in the field of thermal management for many years and is a high-tech enterprise integrating R&D, production, and sales. With the rapid development of industries such as new energy vehicles, energy storage systems, high-performance CPU/GPU chips, AI intelligent automation, 5G communication, and aerospace, Ziitek has developed a wide range of products—including thermal pads, thermal pastes, phase change materials, EMI shielding materials, heating films, and foamed silicone seals—through continuous independent innovation by senior engineers. These products accurately match the heat dissipation and sealing needs of various industries. Headquartered in Dongguan, the company has established production bases in Kunshan, Taiwan Province, and Vietnam to quickly respond to global customers.

TIF® 120-20-10UF Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

• Good thermal conductivity
• Good softness and fillability
• Self-adhesive without the need for additional surface adhesives
• Good insulation performance
• RoHS compliant
• UL recognized

• Cooling components to the chassis of frame
• High-speed mass storage drives
• Heat sinking housing at LED-lit BLU in LCD
• LED TV and LED-lit lamps
• RDRAM memory modules
• Micro heat pipe thermal solutions

1. Our value message is “Do it right the first time, total quality control."
2. Our core competency is thermal conductive interface materials.
3. Competitive advantage products.
4. Confidentiality agreement and business secret contract.
5. Free sample offer.
6. Quality assurance contract.