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Thermal Insulation Materials Silicone Heat Electrical Cooler Material Heat Resistant Thermal Pad for GPU CPU

Thermal Insulation Materials Silicone Heat Electrical Cooler Material Heat Resistant Thermal Pad for GPU CPU

Thermal Insulation Materials Silicone Heat Electrical Cooler Material Heat Resistant Thermal Pad for GPU CPU
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Thermal Insulation Materials Silicone Heat Electrical Cooler Material Heat Resistant Thermal Pad for GPU CPU
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIS800
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/pcs
Packaging Details: 24*23*12CM
Delivery Time: 3-6 work days
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Detailed Product Description
Keyword: Thermal Insulation Materials Application: Chip Heat Sink
Continous Use Temp: -45 To 180℃ Compliance: UL & RoHS
Materials: Ceremic Filled Silicone Elastomer Feature: Soft And High Thermal Conductive
Highlight:

GPU CPU Heat Resistant Thermal Pad

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Thermal Insulation Materials

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Silicone Heat Electrical Cooler Material

Thermal Insulation Materials Insulation Silicone Heat Electrical Cooler Material Heat Resistant Thermal Pad for GPU CPU

 

Company pfrofile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Thermal Insulation Materials Silicone Heat Electrical Cooler Material Heat Resistant Thermal Pad for GPU CPU 0

 

TIS800-Series-Datasheet.pdf

 

The TIS™800 Series products are the high-efficiency insulation ones with thermal conduction properties. The supplement of the insulation base film made by silica gel into the heat-conduction material creates a great effect on both the insulation and heat conduction.


Features:


> Highly compliant surface characteristic with high thermal conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:


> Power conversion equipment
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface

 

 

Typical Properties of TIS™800 Series

Product Name TISTM806 TISTM808 TISTM810 TISTM812 TISTM818 Test Method
Color Gray Gray Gray Gray Gray Visual
Construction &
Compostion
Ceramic filled silicone e ***
Composite Thickness

0.006"/

0.152mm

0.008"/

0.203mm

0.010"/

0.254mm

0.012"/

0.304mm

0.018"/

0.457mm

ASTM D751
Specific Gravity 2.2 g/cc ASTM D297
Heat Capacity 1 l/g-K ASTM C351
Hardness 65 Shore A ASTM 2240
Tensile Strength 450 psi >600 psi >600 psi >600 psi >600 psi ASTM D412
Continuos Use Temp -45℃ to 180℃ ***
Dielectric Breakdown Voltage >1500 VAC >3500 VAC >5000 VAC >5000 VAC >5000 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 5.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 1.6 W/m-K ASTM D5470
Thermal Impedance @50psi 0.21℃-in²/W 0.35℃-in²/W 0.82℃-in²/W 1.23℃in²/W 1.83℃-in²/W ASTM D5471
 
 
 

Standard Thicknesses:
0.009"(0.228mm) 0.012"(0.304mm)
0.018"(0.457mm)
Consult the factory alternate thickness.

 

Standard Sizes:
12" x 160'(304mm x 48.76M)
Individual die cut shapes can be supplied.

 

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on doule side with "A2" suffix.

 

Reinforcement:
TIS™ series sheets are fiberglass reinforced.

 

Thermal Insulation Materials Silicone Heat Electrical Cooler Material Heat Resistant Thermal Pad for GPU CPU 1

 

Packaging Details & Lead time

 

The packaging of thermal insulation materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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