Send Message
Home ProductsSilicone Thermal Pad

Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board

Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board

Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board
video
Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF1120-15-02F Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Contact Now
Detailed Product Description
Products Name: Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard/mother Board Thermal Conductivity: 1.5W/m-K
Fire Rating: 94 V0 Dielectric Breakdown Voltage: >5500 VAC
Outgassing(TML): 0.35% Specific Gravity: 2.3g/cc
Hardness: 60±5 Keywords: Thermal Gap Pad
Application: Mainboard/mother Board
Highlight:

Mainboard Thermal Gap Pad

,

Mother Board Thermal Gap Pad

,

1.5W Thermal Gap Pad

Exceptional Thermal Performance 1.5W Thermal Gap Pad for Mainboard/mother board


Company Profile

 

With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

 

The TIF1120-02F Series is an extremely soft gap filling material rated at a thermal conductivity of 1.5W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. ZiitekTIF1120-15-02F is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

 

TIF100-02F-Datasheet-REV02.pdf

 

Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board 0

Features

 

> RoHS compliant 1.5W/mK
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
Supplied with protective liners for ease of use
> Electrically isolating
> High durability

 

 

Applications

 

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

 

 

Typical Properties of TIF1120--15-02F Series
Color
Gray
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.3 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.020"(0.5mm) to 0.200"(5.0mm)
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
60±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 

>5500 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp

 

-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.35%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X10¹²"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 

Standard Thicknesses:


0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm)

0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm)

0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)


Consult the factory alternate thickness.


Standard Sheets Sizes:


8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:


Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:


TIF™ series sheets type can add with fiberglass reinforced.

 

Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board 1

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

 

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

 

Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board 2

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

Other Products