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4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel

4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel

  • 4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel
  • 4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel
4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TIE380-45
Payment & Shipping Terms:
Minimum Order Quantity: 5kg
Packaging Details: 1kg/can
Delivery Time: 3-8 work days
Payment Terms: T/T
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Detailed Product Description
Products Name: 4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel Feature: Heat Cured Epoxy Adhesive
Usage: Bonding Of Electronics Hardness: 92 Shore A
Chemical Type: Epoxy Components: One Component Thermal Conductive Glue
Key Substrates: Metals, Ceramics Key Words: Thermal Conductive Glue
Highlight:

Thermal Conductive Glue Material

,

Conductive Epoxy Resin Potting Compound

,

Conductive Epoxy Resin Adhesive Gel

4.5W/MK Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance

 

TIE®380-45 is a single-component heat-curable modified epoxy resin adhesive containing high-purity thermally conductive fillers. It features high thermal conductivity, low shrinkage, high bonding strength, and excellent thermal shock resistance. Ready-to-use,it is suitable for automatic dispensing / screen printing. It is used for structural thermal conductive bonding, fixing,and potting of electronic components and heat sinks, improving heat dissipation efficiency and long-term reliability.

 

Feature

 

> High thermal conductivity
> Single-component design, easy and efficient to use
> Strong bonding performance and stable structure
> Low shrinkage rate
> Good thermal shock resistance

 

Application

 

> Thermal conductive bonding for power electronic devices
> LED lighting field
> Encapsulation and fixing of precision electronic components
> PCB board heat dissipation treatment
> Thermal conductive bonding of core components of medical devices

 

Typical Properties of TIE®380-45
Property Value Test Method
Construction & Composition Epoxy resin -
Appearance (Before Curing) Gray Paste Visual
Appearance (After Curing) Gray Solid Visual
Components Single Component -
Viscosity(cps) 15,000 GB/T 10247
Density(g/cm³) 2.0 ASTM D2240
Hardness(Shore A) 92 ASTM D2240
Recommended Operating Temperature (°C) -40 ~ 200℃ -
Shear strength (psi) (AI/AI) 25℃ >2900 ASTM D1002
Thermal Conductivity(W/m-K) 4.5 ASTM D5470
Shelf Life (Day) @25℃ 10 (Unopened) -
Shelf Life (Month) @0℃ 6(Unopened) -
Curing Conditions
Curing Temperature 100°C Curing Time 4h Ziitek Test Method
Curing Temperature 125°C Curing Time 4h Ziitek Test Method

4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel 0

Application Guide


Notice:


1.Pleascareulreadthesafetyandhginenformaioneforeuseandstriclfolwteinstructionsontheproductlabeansaftmanual


2.To ensure thatelectronicpackagingcomponentsmaintain stable andexcellent performanceover thelong term,thesurfaceof the components must be thoroughly cleaned before each packaging to remove dust, moisture, salt, grease,and other contaminants. These substances can cause quality issues such as short circuits, poor adhesion, and corrosion.


3. Storage methods and temperature can affect the shelf life.


Safety/Hygiene:


1. Similar to other resin products,this product is irritating to human skin and eyes. In some individuals,skin contact or inhalation of its emitted vapors may cause allergic reactions, primarly characterized by rash and skin itching. In high-temperature work environments,it may also trigger respiratory odor sensitivity.


2. The curing agent is corrosive to skin and eyes. Direct contact can cause burns. In some individuals, skin contact or inhalation of its emitted vapors may cause skin or respiratory allergies,with symptoms including rash, itching,and dificulty breathing. Odor sensitivity of the respiratory system may also occur during handling.


3. Good hygiene and safety practices must be observed when handling this product. Safety goggles and chemical-resistant clothing should be worn during work to avoid direct contact. For detailed information on engineering controls, personal protective equipment (PPE), and first aid measures, please refer to the Product Safety Data Sheet (SDS).


Product Specifications


1 kg/can, 300 ml/tube


If you would like to learn about products in different specifications, please contact our company.
If you want to learn more about thermal conductive materials,please visit our company's website.

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel 1

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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