Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

The TIR^®700-25 Series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achieves exceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.

• Good thermal conductivity of 25 W/m·K
• Ultra-low thermal resistance
• Works under low pressure
• Non-insulating material with electrical conductivity
• Non-adhesive surface

• Between chips and heat dissipation modules
• 5G communication equipment
• Optoelectronics industry
• Wearable devices

• Standard Thickness: 0.012" (0.30 mm) – 0.200" (5.00 mm)
• Standard Size: 5" × 6" (127 mm × 152.4 mm)

The TIR^®700-25 series products can be molded into different shapes for supply. If you need different thicknesses, larger sizes, or more information on thermal conductive materials, please contact our company.

1. With PET film or foam for protection
2. Use paper card to separate each layer
3. Export carton inside and outside
4. Meet with customers' requirement — customized

Lead Time: Quantity (Pieces): 5000 — Estimated Time (days): To be negotiated

Ziitek was founded in 2006 as a high-tech enterprise, specializing in the research and development, manufacturing, and solution development of thermal conductive, heating, sealing, and EMI materials.

• Production Capacity Layout: Headquarter in Dongguan, Guangdong Province; production bases in Kunshan, Jiangsu Province, Taiwan, and Vietnam. Global layout ensures rapid delivery.
• Application Fields: New energy vehicles, energy storage, high-performance chips, laptops, security, AI automation, 5G communication, aerospace.
• Core Products: TIF thermal conductive pads series, Z-Paster non-silicon thermal conductive pads series, TIG thermal paste, TIC phase change thermal material, TIS thermal insulating material, TIA thermal double-sided adhesive, TIR high thermal conductivity conductive material, TIF900 series EMI materials, K-heat heating products (PI heating film, silicone heating sheet, PTC heater), Z-foam foaming silicone sealing parts, TCP thermal engineering plastics.
• Quality Certification: IATF16949, ISO9001, ISO14001, QC080000; products comply with RoHS, REACH, UL.

Ziitek gathers professional R&D engineers and implements a joint development model, deeply participating in the early design of customer products. We empower customers with technological innovation and are committed to becoming a trusted material strategic partner for global customers.