Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product introduction
TIF®500BS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.
Features
> Good thermal conductive: 2.6W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications
> Cooling components to the chassis of frame
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
|
Typical Properties of TIF®500BS Series
|
| Property |
Value |
Test method |
| Color |
Blue |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.0 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| (0.25~0.50) |
(0.75~5.0) |
| Hardness |
30 Shore 00 |
13 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
5.0 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1013 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
2.6 W/m-K |
ASTM D5470 |
| 2.6 W/m-K |
ISO22007 |
Product Specification
Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
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