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4.0W/mK Thermal Gap Filler Suitable For Thermal Interface Applications In Automotive Industrial And Consumer Electronics

4.0W/mK Thermal Gap Filler Suitable For Thermal Interface Applications In Automotive Industrial And Consumer Electronics

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF100-40-10F
Document: TIF100-40-10F_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm carton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Products Name: 4.0W/mK Thermal Gap Filler Suitable For Thermal Interface Applications In Automotive Industrial And Consumer Electronics Construction: Ceramic Filled Silicone Elastomer
Hardness: 65/60 Shore 00 Keywords: Thermal Gap Filler
Color: Gray Thermal Conductive: 4.0 W/mK
Thickness: 0.010"(0.25mm)~0.200"(5.0mm) Density: 3.2 G/cm³
Application: Automotive Industrial And Consumer Electronics
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4.0W/mK Thermal Gap Filler Suitable For Thermal Interface Applications In Automotive Industrial And Consumer Electronics
Company Profile

Dongguan Ziitek Electronic Material and Technology Co., Ltd. (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable.

Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market.

Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.

Product Description

The TIF®100-40-10F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

Features
  • Good thermal conductivity
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • Naturally tacky needing no further adhesive coating
  • Available in various thicknesses
Applications
  • Motor Controller (MCU)
  • Airborne computer
  • Machine vision camera
  • High performance ASIC chip
  • Central control screen
  • Signal communication
  • New energy vehicle
  • Motherboard chip
  • Radiator
  • AI Processors AI Servers
Typical Properties of TIF®100-40-10F Series
Property Value Test Method
Color Gray Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 3.2 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 60 ASTM 2240
Recommended Operating Temperature -40 to 200℃ -
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 8.0 ASTM D150
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 4.0 ASTM D5470
ISO22007
Product Specifications

Product Thicknesses: 0.010" (0.25mm) ~ 0.200" (5.00mm) with increments of 0.010" (0.25mm).

Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

ZIITEK Independent R&D team working on thermal conductive materials
Ordering Process
How do I place an order?

1. Click the "Send messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Frequently Asked Questions
What's the thermal conductivity test method given on the data sheet?
All the data in the sheet are actual tested. Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
How to find a right thermal conductivity for my applications?
It depends on the watts of power source, ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Do you accept custom orders?
Yes, welcome to custom orders. Our custom elements including dimension, shape, color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order, please kindly offer a drawing or leave your custom order information.
How much are the pads?
Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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