High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For High Performance Computing

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What Is a Thermal Interface Material (TIM)?
Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.

What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.

Why Do AI Servers Need High-Performance Thermal Interface Materials?
AI GPUs, CPUs and Application Specific Integrated Circuits generate high power and heat flux, requiring efficient heat transfer to heat sinks or cold plates. High-performance TIMs help reduce interface thermal resistance.

How Do I Choose the Right Thermal Interface Material?
Start with heat source power, gap thickness, target thermal resistance, operating temperature, contact area, assembly pressure, electrical insulation, flame resistance and reliability requirements.

What Thermal Interface Materials Does ZIITEK Offer?
ZIITEK focuses on thermal management materials and solutions for electronics. Our portfolio includes thermal pads, thermal gels and other thermal management materials, with solutions matched to gap, thermal performance, thickness, hardness, electrical insulation and reliability requirements.