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Thermal Conductive Pad Offering 6.0W/mK High Thermal Conductivity And Excellent Electrical Insulation For Electronic Assemblies

Thermal Conductive Pad Offering 6.0W/mK High Thermal Conductivity And Excellent Electrical Insulation For Electronic Assemblies

Thermal Conductive Pad Offering 6.0W/mK High Thermal Conductivity And Excellent Electrical Insulation For Electronic Assemblies
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Thermal Conductive Pad Offering 6.0W/mK High Thermal Conductivity And Excellent Electrical Insulation For Electronic Assemblies
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF100 6050-19
Document: TIF100 6050-19_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: Thermal Conductive Pad Offering 6.0W/mK High Thermal Conductivity And Excellent Electrical Insulation For Electronic Assemblies Sample: Sample Free
Thickness Range: 0.040"~0.200"(1.00mm~5.0mm) Fire Rating: UL 94 V-0
Color: Yellow Thermal Conductivity: 6.0W/m-K
Dielectric Constant@1MHz: 6.0 Breakdown Strength(V/mm）: ≥5500
Keywords: Thermal Conductive Pad Application: Electronic Assemblies
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Thermal Conductive Pad Offering 6.0W/mK High Thermal Conductivity And Excellent Electrical Insulation
The TIF®100 6050-19 Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Key Features
  • High thermal conductivity (6.0W/mK)
  • Good softness and fillability
  • Self-adhesive without the need for additional surface adhesives
  • Good insulation performance
Applications
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU Cooling
  • New energy vehicle power systems
Typical Properties of TIF®100 6050-19 Series
Property Value Test Method
Color Yellow Visual
Construction & Composition Ceramic filled silicone elastomer -
Density (g/cm³) 3.4 ASTM D792
Thickness Range (inch/mm) 0.040~0.200 / 1.00~5.00 ASTM D374
Hardness (Shore 00) 50 ASTM 2240
Continuous Use Temp -40 to 200℃ -
Breakdown Voltage (V/mm) ≥ 5500 ASTM D149
Dielectric Constant@1MHz 6.0 ASTM D150
Volume Resistivity (Ohm-meter) ＞1.0×10¹² ASTM D257
Thermal Conductivity (W/m-K) 6.0 ASTM D5470 / ISO22007
Fire Rating V-0 UL 94 (E331100)
Product Specifications
Standard Thickness: 0.040" (1.00 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
TIF®100 6050-19 Series Thermal Conductive Pad product image
Packaging & Lead Time
Packaging Details:
  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized to meet customer requirements
Lead Time: Quantity: 5000 pieces - To be negotiated
About Ziitek
Ziitek, founded in 2006, is a high-tech enterprise specializing in research and development of heat conduction, heating, sealing and EMI products. Its headquarters is in Dongguan, Guangdong Province, with production bases in Kunshan, Taiwan Province and Viet Nam. The company strictly abides by the international quality management system, and has passed the authoritative certifications such as IATF16949:2016, ISO9001:2015, QC080000:2017 and ISO14001:2015. The whole series of products conform to ROHS, REACH and UL specifications. From thermal interface materials to EMI shielding, from heating products to sealing engineering plastics, Zhaoke serves global customers with strict quality standards and is committed to becoming a reliable strategic partner.
Frequently Asked Questions
Are you a trading company or manufacturer?
We are manufacturer in China and VietNam.
Is GAP PAD offered with an adhesive?
Most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
What Is a Thermal Interface Material (TIM)?
Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
What Is Thermal Resistance in Thermal Interface Materials?
Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
What Is the Difference Between Thermal Conductivity and Thermal Resistance?
Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area and interface conditions.
Does Higher Thermal Conductivity Always Mean Better Cooling?
Not necessarily. Thickness, interface contact, compression and actual thermal resistance can significantly affect final cooling performance.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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