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Heat dissipation application of thermal paste

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Heat dissipation application of thermal paste
Latest company news about Heat dissipation application of thermal paste

Heat dissipation application of thermal paste

 

Thermal paste is an auxiliary material used to dissipate heat in electronic devices and ‌ has high thermal conductivity. ‌ Its main use is to conduct heat from electronic devices quickly and ‌ evenly to a heat sink, ‌ helping devices maintain stable operating conditions in high-temperature environments. ‌ Thermal pastes work by using thermally conductive particles in the paste substance (such as metal oxide particles) ‌ to conduct heat from a heat source to a heat sink. ‌ These heat-conducting particles act as a "thermal bridge" in the paste, ‌ connecting heat sources and radiators closely together, ‌ forming an effective heat-conducting channel. ‌ At the same time, ‌ ingredients such as silicone oil in the ‌ thermal conductive paste can fill the gaps between the contact surfaces, ‌ reducing thermal resistance and ‌ improving heat dissipation. ‌

 

latest company news about Heat dissipation application of thermal paste  0

 

In electronic devices, the use of ‌ thermal paste can effectively solve the problem of heat dissipation caused by unreasonable thermal design, ‌ excessive heat flux, or excessive internal temperature of the device. ‌ It can prevent devices from overheating, ‌ reduce temperature, ‌ extend device life, ‌ and improve device stability and reliability. ‌ Although thermally conductive paste is an effective solution for heat dissipation, ‌ it does not solve all heat dissipation problems. ‌

 

latest company news about Heat dissipation application of thermal paste  1

 

In application scenarios, ‌ thermal paste is often used to fill the gap between the CPU and the heat sink, ‌ helping to conduct the heat emitted by the CPU to the heat sink, ‌ keeping the CPU temperature at a level where it can work steadily. ‌ In addition, ‌ thermal paste can also be applied to electronic components, ‌ electricals, ‌ household appliances, ‌LCD, ‌LED, ‌CPU heatsinks and other products, ‌ increase heat conduction function, ‌ fill gaps, ‌ play the role of insulation, ‌ waterproof, ‌ moisture-proof, ‌ shock proof and so on. ‌ It is generally used in mid-level electronic systems such as high-performance central processing units and graphics card processors, ‌ cpus, ‌ power supplies, ‌ memory modules, ‌LED lamps, ‌ semiconductor blocks, and heat sinks.

 

 



 

Pub Time : 2024-07-29 11:30:09 >> News list
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