The core features of TIF700RES and their alignment with server requirements

The power consumption of modern server CPUs/GPUs is extremely high, and the heat is concentrated instantly. High thermal conductivity materials are needed to quickly transfer the heat to the heat dissipation module (such as heat pipes, cold plates or fins). A thermal conductivity of 10W/MK of TIF700RES is at a high-end level and can effectively reduce the interface thermal resistance.

Application advantages:

Filling large gaps: The internal structure of the server is complex, and the heights of components may vary (such as capacitors and inductors surrounding the CPU). The high compression ratio of TIF700RES can fill large and uneven assembly gaps (usually up to 3-5mm or even higher), ensuring adequate contact.
Low stress protection: The material is soft, and the mechanical stress on sensitive components during vertical compression is small, avoiding damaging BGA packages or ceramic capacitors.
Automatic tolerance adaptation: When the heat dissipation module and multiple chips (such as multiple GPUs or memory) are in contact simultaneously, it can adapt to the height difference and ensure good heat conduction on each contact surface.
Typical application positions in server products:
Between the main processor (CPU) and the heat sink: Especially between the large heat sink base and the CPU cover, when there is a height difference or when the protection of surrounding components needs to be considered.
Graphics processor (GPU): Graphics card modules of AI servers and GPU computing servers.
Memory cooling: High-frequency DDR5 memory modules require adding heat sinks, and heat transfer pads are filled between the memory chips and the heat sinks.
Power supply module (VRM): The MOSFETs and inductors around the CPU/GPU of the server motherboard generate a lot of heat, and heat transfer pads are needed to transfer the heat to the chassis or special heat sinks.
Solid-state drives (NVMe SSD): Heat dissipation of the main control chip of high-speed SSDs.
Chipset (PCH) and other controller chips.

Engineering considerations to be taken into account when using TIF700RES

Thickness selection: It is necessary to precisely measure the actual gap between the heat dissipation interfaces in the server (considering tolerances and assembly pressure), and select a gasket that is slightly thicker than the gap, relying on compression to fill. The compression rate is usually recommended to be between 15-30% for optimal thermal efficiency and structural stability.
Hardness (Shore 00): TIF700RES usually has a relatively low hardness value (such as Shore 00 30-50), which is very soft. During installation, it is necessary to operate carefully to avoid excessive stretching or tearing.

Long-term reliability:

Low oil output: High-quality thermal pads should have a low oil output rate to prevent silicone oil from seeping out and contaminating the surrounding circuits or causing the gasket itself to crack and age under long-term high temperatures.
Aging resistance: Servers require 7x24-hour uninterrupted operation, and the material must maintain stable performance under long-term high temperatures (such as 80-100℃), without hardening or plastic deformation.