The helpful companion of the heat dissipation module - thermal conductive silicone sheet
The heat dissipation module is a module unit used for heat dissipation in systems, devices, and equipment. Using a heat dissipation module for cooling is one of the limited heat dissipation methods for most compact electronic products at present, and it is also the main heat dissipation method. In heat dissipation modules, similar products such as thermal conductive silicone sheets are mostly used to assist in heat dissipation, and the combination of the two achieves a better heat dissipation effect.
First of all, the thermal conductivity range of the thermal silicone sheet is very wide, ranging from 1.2 W/mk to 25 W/mk. Generally, as long as the temperature difference required by the product can be achieved, it is sufficient. If the thermal conductivity requirement is not very high, then a low thermal conductivity silicone sheet can be used. Because these silicone sheets have good cost performance, reasonable prices, stable performance and good thermal conductivity.
Because the thermal conductive silicone sheet is very soft and has good compressibility, the compression ratio of the thermal conductive silicone sheet is over 20% (depending on the specific product hardness), so when choosing the thickness of the thermal conductive silicone sheet, the compression ratio issue must be taken into consideration. This will enable the thermal conductive silicone sheet to fit better between the heat source and the heat sink, significantly increasing the effective contact area and thereby improving the heat conduction effect.
Note: When choosing a heat dissipation module, using a heat-conducting silicone film is not about having the highest thermal conductivity. Instead, it depends on specific circumstances to select the appropriate product. Also, it's not that the more expensive it is, the better it is. Choosing the right one or the suitable one is what makes it good.
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