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Grey Silicone Heat Sink Thermal Pad For 5G Projects Artificial Intelligence

Grey Silicone Heat Sink Thermal Pad For 5G Projects Artificial Intelligence

Grey Silicone Heat Sink Thermal Pad For 5G Projects Artificial Intelligence
Grey Silicone Heat Sink Thermal Pad For 5G Projects Artificial Intelligence
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF500-50-11US
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Thermal Conductivity: 5 W/mK KEYWORD: Thermal Pad For Artifical Intelligence
Color: Gray Part Number: TIF500-50-11US
Keywords: Silicone Pad In 5G Projects
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Customized grey heat sink thermal pad for artifical Intelligence in 5G projects TIF500-50-11US silicone pad


Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.



The TIF™500-50-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
TIF500-50-11US Datasheet-REV02.pdf
Good thermal conductive: 5 W/mK
Naturally tacky needing no further adhesive coating
Soft and Compressible for low stress applications
Available in varies thickness
Automotive engine control units
Telecommunication hardware
Handheld portable electronics
Semiconductor automated test equipment (ATE)
Cooling components to the chassis of frame
High speed mass storage drives
Heat Sinking Housing at LED-lit BLU in LCD
LED TV and LED-lit lamps
RDRAM memory modules
Micro heat pipe thermal solutions
Typical Properties of TIF500-50-11US
Product Name
TIF500-50-11US  Series
Construction & Compostion
Ceramic filled silicone rubber
Specific Gravity
3.0 g/cc
Dieletcric Constant@1MHz
4.0 MHz
20 Shore 00
Continuos Use Temp
-40 to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
5 W/mK
0.5mm to 5.0mmT


Standard Thicknesses:
 0.020" (0.51mm)  0.030" (0.76mm)  0.040" (1.02mm)  0.050" (1.27mm)  0.060" (1.52mm)      0.070" (1.78mm)  0.080" (2.03mm)  0.090" (2.29mm)  0.100" (2.54mm)  0.110" (2.79mm)  0.120" (3.05mm)      0.130" (3.30mm)  0.140"  (3.56mm) 0.150" (3.81mm)  0.160" (4.06mm)  0.170" (4.32mm)  0.180" (4.57mm)     0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

TIF™ series sheets type can add with fiberglass reinforced.

Grey Silicone Heat Sink Thermal Pad For 5G Projects Artificial Intelligence 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract



Ziitek Culture

Quality :
Do it right the first time, total quality control
Work precisely and thoroughly for effectiveness
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

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