Green Color Electronic Thermal Gap Filler Gpu IC Chip Thermal Conductive Pad for AI Service dissipate heat

The TIF®160-07S Series thermal gap filler is engineered for efficient heat transfer in electronic applications, filling gaps between heating and cooling components while providing insulation, damping, and sealing functions. This material supports equipment miniaturization and ultra-thin design requirements.

• Good thermal conductivity: 1.5W/mK
• Available in various thickness options
• UL recognized certification
• Broad range of hardnesses available
• High tack surface reduces contact resistance
• Electrically isolating properties
• RoHS compliant
• Naturally tacky surface requiring no additional adhesive coating

• LED TV / LED lighting systems
• CD-ROM, DVD-ROM cooling solutions
• Semiconductor automated test equipment (ATE)
• CPU thermal management
• Memory modules
• Graphics cards
• Telecommunication hardware
• Motherboards and mainboards
• IT infrastructure components
• GPS navigation and portable devices

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Ziitek maintains an independent R&D team with extensive experience in thermal conductive materials. Our well-equipped testing facilities allow us to conduct comprehensive testing with customer samples, ensuring we identify the most suitable thermal solution for each application.