Name: High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance For Mainboard/Mother Board
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF500US Series
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance For Mainboard/Mother Board

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF500US Series

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Prodcuts Name:	High Cost-Effective 2.6W/MK CPU Thermal Pad The TIF500US Outstanding Thermal Performance For Mainboard/Mother Board	Thickness:	0.25~5.0mmT(0.010"~0.200")
Specific Gravity:	3.0g/cc	Dielectric Breakdown Voltage:	>5500 VAC
Thermal Conductivity:	2.6W/m-K	Color:	Purple
Keywords:	CPU Thermal Pad	Application:	AI Processors AI Servers ,mainboard/Mother Board
Highlight:	Violet Silicone Heat Transfer Pad , 2.6W/MK Silicone Heat Transfer Pad , Violet Self Adhesive Thermal Pad

High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance For Mainboard/Mother Board

Company profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Prodducts description

The TIF^®500US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances,uneven surfaces,and the susceptibility of delicate components to mechanical damage.

Features

> Good thermal conductive: 2.6 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications

> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Rainproof LED Power
> Telecommunication hardware

> mainboard/mother board

> IT infrastructure

> GPS navigation and other portable devices

>LED Flesible strip, LED bar

Typical Properties of TIF^®500US Series
Property	Value		Test method
Color	Purple		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.5)	(0.75~5.0)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.3 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹³ Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	2.6		ASTM D5470
	2.6		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm)
with increments of 0.010" (0.25 mm)
Standard Size:16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance For Mainboard/Mother Board 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance For Mainboard/Mother Board 1

Tag:

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Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance For Mainboard/Mother Board

High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance For Mainboard/Mother Board

Violet Silicone Heat Transfer Pad

2.6W/MK Silicone Heat Transfer Pad

Violet Self Adhesive Thermal Pad

Company profile

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

laptop gpu thermal pad,

cpu cooling pad,