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3.0W/MK CPU Thermal Pad Electrically Isolating Silicone Thermal Pad With 2.0 Millimeter Thickness For Heat Transfer

3.0W/MK CPU Thermal Pad Electrically Isolating Silicone Thermal Pad With 2.0 Millimeter Thickness For Heat Transfer

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF180-30-11ES thermal pad
Document: TIF100-30-11ES_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm carton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Products Nam: 3.0W/MK CPU Thermal Pad Electrically Isolating Silicone Thermal Pad With 2.0 Millimeter Thickness For Heat Transfer Hardness: 12 Shore 00
Keywords: Thermal Pad Color: Dark Gray
Density: 3.15g/cm³ Construction: Ceramic Filled Silicone Elastomer
Thickness: 2.0mmT Application: For CPU Heat Transfer
Highlight:

new developed thermal conductive gap filler

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gray thermal conductive gap filler

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3.0W/mK thermal conductive gap filler

3.0W/MK CPU Thermal Pad Electrically Isolating Silicone Thermal Pad With 2.0 Millimeter Thickness For Heat Transfer


Company Profile

 
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Products description


TIF®180-30-11ES is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features:


> High thermal conductivity
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:


>  Power tools
>  Network communication products
>  Electric vehicle batteries
>  Computer CPU/GPU Cooling
>  New energy vehicle power systems

>  Heat pipe thermal solutions
>  Memory Modules 


Typical Properties of TIF®100-30-11ES Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³)

3.15

ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.75)

0.040~0.200

(1.00~5.00)

ASTM D374
Hardness (Shore 00) 12 12 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity >1.0X1012Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470
3.0 ISO22007
Fire rating V-0 UL 94 (E331100)


Product Specifications


Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).


The TIF®  series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.


3.0W/MK CPU Thermal Pad Electrically Isolating Silicone Thermal Pad With 2.0 Millimeter Thickness For Heat Transfer 0

Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 
FAQ
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
 
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.


Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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