Name: CPU Thermal Pad 4.5mm Thickness Thermal Conductive Material With Silicone Base And Flame Retardant For Electronic Devices
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1180-30-11ES thermal pad
Price: 4.10 USD
Availability: InStock

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CPU Thermal Pad 4.5mm Thickness Thermal Conductive Material With Silicone Base And Flame Retardant For Electronic Devices

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF1180-30-11ES thermal pad
Document:	TIF100-30-11ES_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Products Name:	CPU Thermal Pad 4.5mm Thickness Thermal Conductive Material With Silicone Base And Flame Retardant For Electronic Devices	Hardness:	12 Shore 00
Keywords:	CPU Thermal Pad	Color:	Dark Gray
Thermal Conductivity:	3.0W/mK	Construction:	Ceramic Filled Silicone Elastomer
Thickness:	4.5mmT	Sample:	Free
Application:	Electronic Devices
Highlight:	4.5mmT silicone thermal pad , thermal pad for CD Rom , thermal pad for DVD Rom

CPU Thermal Pad 4.5mm Thickness Thermal Conductive Material With Silicone Base And Flame Retardant For Electronic Devices

Company Profile

Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.

Products description

TIF^®1180-30-11ES thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> High thermal conductivity
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications

> RDRAM memory modules

> Micro heat pipe thermal solutions

> Automotive engine control units

> Automotive electronics

> Set top boxes

> Audio and video components

> IT infrastructure

Typical Properties of TIF^®100-30-11ES Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.15		ASTM D792
Thickness Range(inch/mm)	0.020~0.030 (0.50~0.75)	0.040~0.200 (1.00~5.00)	ASTM D374
Hardness (Shore 00)	12	12	ASTM 2240
Continuos Use Temp	-40 to 200℃		***
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	7.0		ASTM D150
Volume Resistivity	＞1.0X10¹²Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	3.0		ASTM D5470
	3.0		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications

Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

CPU Thermal Pad 4.5mm Thickness Thermal Conductive Material With Silicone Base And Flame Retardant For Electronic Devices 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

FAQ:

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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CPU Thermal Pad 4.5mm Thickness Thermal Conductive Material With Silicone Base And Flame Retardant For Electronic Devices

CPU Thermal Pad 4.5mm Thickness Thermal Conductive Material With Silicone Base And Flame Retardant For Electronic Devices

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