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CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling

CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling

CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
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CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1200-30-11ES thermal pad
Document: TIF100-30-11ES_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
Contact Now
Detailed Product Description
Products Name: CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling Hardness: 12 Shore 00
Keywords: Thermal Pad Color: Dark Gray
Thermal Conductivity: 3.0W/mK Density: 3.15g/cm³
Thickness: 5.0mmT Sample: Free
Highlight:

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CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Product Overview
The TIF®1200-30-11ES Series is a thermal pad specifically designed to tackle high-level cooling challenges and environments sensitive to extreme mechanical stress. It combines high thermal conductivity with near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and high heat flux electronic components.
Key Features
  • Good thermal conductivity: 3.0W/mK
  • Thickness: 5.0mm
  • Hardness: 12 Shore 00
  • Moldability for complex parts
  • High tack surface reduces contact resistance
  • Fiberglass reinforced for puncture, shear and tear resistance
Applications
  • Power supply
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • IT infrastructure
  • GPS navigation and other portable devices
  • CD-Rom, DVD-Rom cooling
  • New energy vehicle
  • Motherboard chip
  • Radiator
  • AI Processors AI Servers
Technical Specifications of TIF®100-30-11ES
Property Value Test Method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.15 ASTM D792
Thickness Range (inch/mm) 0.020~0.030 (0.50~0.75) | 0.040~0.200 (1.00~5.00) ASTM D374
Hardness (Shore 00) 12 ASTM 2240
Continuous Use Temp -40 to 200℃ ***
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity ＞1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470 / ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

CPU Thermal Pad Thermal Interface Material product image
Company Advantages
Ziitek has an independent R&D team with experience, rigorous and pragmatic approach. They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we can also perform tests with customers' samples to find more suitable Ziitek materials for every customer.
Frequently Asked Questions
Q: Do you offer free samples?
A: Yes, we are willing to offer free samples.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.

Tag:

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Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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