Name: CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF160-30-11US thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF160-30-11US thermal pad
Document:	TIF100-30-11US_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm carton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Products Name:	CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components	Hardness:	65/20 Shore 00
Keywords:	CPU Thermal Pad	Color:	Dark Gray
Part Number:	TIF160-30-11US	Material:	Ceramic Filled Silicone Elastomer
Thickness:	1.5mmT	Application:	Heat Transfer In Electronic Components
Thermal Conductivity:	3.0W/mK
Highlight:	20±5 Shore00 Thermal Gap Pad , Mass Storage Devices Thermal Gap Pad , thermal gap filler pad 1.5mmT

CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components

Company Profile

Ziitek Technology CO.,Ltd is a professional manufacturer of thermal interface materials with 20 years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.

Products description

TIF^®100-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combineshigh thermal conductivity with exceptional gel-level softness achieving a perfcly low-stress fit ,It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

>High thermal conductivity
>Super soft and highly compliant
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance

Applications

>Mass storage devices

>Automotive electronics

>Set top boxes

>Micro heat pipe thermal solutions

>Automotive engine control units

>Telecommunication hardware

>Power tools
>Network communication products
>Electric vehicle batteries
>Computer CPU/GPU Cooling
>New energy vehicle power systems

Key attributes

Typical Properties of TIF^®100-30-11US Series
Property	Value		Test method
Colo	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	7.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity (W/m-K)	3.0		ASTM D5470
	3.0		ISO22007

Product Specifications

Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components

CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components

20±5 Shore00 Thermal Gap Pad

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Key attributes

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