Name: CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1100-30-11US thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF1100-30-11US thermal pad
Document:	TIF100-30-11US_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm carton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Products Name:	CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment	Hardness:	65/20 Shore00
Keywords:	CPU Thermal Pad	Color:	Dark Gray
Part Number:	TIF1100-30-11US	Material:	Ceramic Filled Silicone Elastomer
Thickness:	2.5mmT	Thermal Conductivity:	3.0W/mK
Highlight:	2.5mmT Thermal Conductive Gap Filler , Telecommunication Thermal Conductive Gap Filler , 20±5 Shore 00 Thermal Gap Filler

CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment

Company Profile

Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply involved in the field of heat conducting materials for 20 years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.

Products description

TIF^®1100-30-11US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

>Cooling components to the chassis of frame
>High speed mass storage drives
>Heat Sinking Housing at LED-lit BLU in LCD
>LED TV and LED-lit lamps
>RDRAM memory modules

Applications

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>LED floor light
>Routers
>Medical Devices
>Auditioning electronic products
>Unmanned aerial vehicle(UAV)
>Photovoltaic
>Signal communication
>New energy vehicle
>Motherboard chip
>Radiator
>AI Processors AI Servers

Key attributes

Typical Properties of TIF^®100-30-11US Series
Property	Value		Test method
Colo	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	7.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity (W/m-K)	3.0		ASTM D5470
	3.0		ISO22007

Product Specifications

Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment

CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment

2.5mmT Thermal Conductive Gap Filler

Telecommunication Thermal Conductive Gap Filler

20±5 Shore 00 Thermal Gap Filler

Key attributes

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad