Name: 2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF180-30-11US thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF180-30-11US thermal pad
Document:	TIF100-30-11US_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm carton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Products Name:	2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation	Hardness:	65/20 Shore00
Keywords:	Thermal Pads	Color:	Dark Gray
Part Number:	TIF180-30-11US	Construction & Compostion:	Ceramic Filled Silicone Elastomer
Thickness:	2.0mmT	Application:	Automotive Engine Control Units Heat Dissipation
Highlight:	3.0W/MK Silicone Thermal Pads , Automotive Engine Control Units Silicone Pads , 2.0mmT Silicone Thermal Pads

2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Products description

TIF^®180-30-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
>Available in varies thicknesses
>Broad range of hardnesses available
>Outstanding thermal performance

Applications

>Micro heat pipe thermal solutions
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>CPU
>Display card
>Mainboard/mother board
>Notebook
>Power supply

Key attributes

Typical Properties of TIF^®100-30-11US Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	7.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity (W/m-K)	3.0		ASTM D5470
	3.0		ISO22007

Product Specifications

Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation 1

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Tag:

laptop gpu thermal pad,

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Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation

2.0mmT Silicone 3.0W/MK Thermal Pads For Automotive Engine Control Units Heat Dissipation

3.0W/MK Silicone Thermal Pads

Automotive Engine Control Units Silicone Pads

2.0mmT Silicone Thermal Pads

Key attributes

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad