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20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware

20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware

20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware
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20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1100-30-11US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Hardness: 20±5 Shore00 KEYWORD: Gray Silicone Rubber Pads
Color: Gray Part Number: TIF1100-30-11US
Material: Silicone Thickness: 2.5mmT
High Light:

2.5mmT Thermal Conductive Gap Filler

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Telecommunication Thermal Conductive Gap Filler

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20±5 Shore 00 Thermal Gap Filler

20±5 Shore 00 high cost-effective thermal conductive gap filler for Telecommunication hardware


Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

 

TIF100-30-11US-Series-Datasheet-.pdf

 
TIF1100-30-11US  use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
 
Features
<Good thermal conductive:3.0W/mK
<Thickness:2.5mmT
<Hardness:20±5  Shore 00
<Colour: gray

<Fiberglass reinforced for puncture, shear and tear resistance

<Easy release construction

<Electrically isolating

 
Applications

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<Audio and video components

<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling


 

 
Typical Properties of TIF1100-30-11US
 
Product Name  

 TIF1100-30-11US Series

Colour
gray 
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

2.5mmT
Hardness
 20±5Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
 3.0W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 
20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware 0

Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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